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Pasta Solder Sn63 BGA Titik Lebur: 183 ℃ Perbaikan Pasta Timah SMD Patch Vitalizer Pengelasan Chip Perbaikan Penyolderan
Rp135.844
Description
★ Model: sn63
★ Melting point: 183℃
★ Heating temperature: 245℃
★ The solder joint is bright, full and firm
★ It is suitable for BGA tin planting chip maintenance
★ Easy cleaning after welding
Specifications
| Asal | CN (Asal) |
| Nama Merek | KEK |
| Nomor Model | 183 |
| Sertifikasi | ROHS |
| Ukuran partikel | 20-38 μm |
